• Document: AUTOFOCUS SENSORS & MICROSCOPY AUTOMATION IR LASER SCANNING CONFOCAL MICROSCOPE IRLC DEEP SEE. Now See Deeper than ever before
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AUTOFOCUS SENSORS & MICROSCOPY AUTOMATION IR LASER SCANNING CONFOCAL MICROSCOPE IRLC DEEP SEE Now See Deeper than ever before Review and inspection of non visible subsurface defects Non visible and subsurface defects, such as microcracks and microvoids, as well as defects associated with manufacturing often go undetected. Heavy doping during the manufacturing process 2.5mm Square Grid, 0.75mm 2.5mm Square Grid, 0.75mm can make non destructive review and inspection of Spacing, 5μm Line Width Spacing, 5μm Line Width wafer and chip packages very difficult. Standard imaged with 20X at surface imaged with 20X through 700μm thick silicon wafer wide field inspection tools are available using Near Infrared (NIR) or Infrared (IR) illumination sources. However, these systems are not able to penetrate deep nor are they able to selectively image at a specific plane of focus. 20X Image of 200 LPM 20X Image of 200 LPM Ronchi Ruling imaged at Ronchi Ruling imaged surface through 700μm thick silicon wafer A Near-Infrared Confocal Microscope capable of subsurface through silicon interior inspection The combination of a powerful Near-Infrared Laser and a Scanning Confocal Microscope offers several unique advantages over conventional wide-field IR microscopy systems. First and foremost is the ability to in image high resolution sub surface thin sections or optically slice within transparent and semi-opaque samples. This combination also results in deeper penetration of the target, greater resolution and faster image collection. 10X Image of wafer pattern 10X Image of wafer pattern 20X Image of wafer pattern 20X Image of wafer pattern imaged at surface imaged through 700μm wafer imaged at surface imaged through 700μm wafer from backside from backside Nondestructive imaging of, IC chips, MEMS, and various other semiconductor devices Unlike conventional inspection systems, the IRLC DEEP SEE utilizes a Near-IR laser and IR optics ideal for non-destructive subsurface interior investigation of silicon wafers, IC chips, MEMS, Solar Panels, and other devices. By taking advantage of the IR transmission characteristics of silicon, the IRLC DEEP SEE is able to conduct high resolution subsurface inspection of features that cannot be seen any other way. Typical applications include integrity inspection after bonding, Sacrificial Oxide Layer Inspection after etching, inspection for chipping and cracks after grinding or dicing or inspecting SIP (System In Package), 3D Mounting or CSP (Chip Scale Package). Fully motorized hardware and Near-IR optics make confocal imaging easy The IRLC includes a full automation package including precision motorization of the XY stage, objective lens turret, illumination, ND filter selection and Z position. To ensure the clearest and sharpest images during subsurface inspection, the system includes a complete set of Olympus Near-IR Long Working Distance Objectives. Designed for optimal transmission of Near-IR wavelengths, the objectives are ideal for inspecting internal structures of silicon wafers and include correction collars to adjust for varying thickness of surface glass or silicon. One Click dual observation continually in focus The IRLC includes a colour CMOS camera and LED illumination system for bright field imaging allowing operators to

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